Confined Submerged Jet Impingement Boiling of Subcooled FC-72 over Micro-Pin-Finned Surfaces

Abstract

Heat transfer characteristics of confined submerged jet impingement boiling of air-dissolved FC-72 on heated micro-pin-finned surfaces are presented. The dimension of the silicon chips is 10 × 10 × 0.5 mm3 (length × width × thickness) on micro-pin-fins with the four dimensions of 30 × 30 × 60 μm3, 50 × 50 × 60 μm3, 30 × 30 × 120 μm3, and 50 × 50 × 120 μm3 fabricated by using the dry etching technique. For comparison, experiments of jet impinging on a smooth surface were also conducted. The results have shown that submerged jet impingement boiling gives a large heat transfer enhancement compared with pool boiling, and all micro-pin-fins showed better heat transfer performance than a smooth surface. The effects of jet Reynolds number, jet inlet subcooling, micro-pin-fins, and nozzle-to-surface distance on jet impingement boiling heat transfer were explored. For micro-pin-fins, the maximum allowable heat flux increases with jet Reynolds number and subcooling. The largest value of the maximum allowable heat flux of micro-pin-fins by submerged jet impingement boiling is 157 W/cm2, which is about 8.3 times as large as that for the smooth surface in pool boiling. Also, Nusselt number has a strong dependence on Reynolds number.