Abstract
The electronics industry in Taiwan has achieved a complete information and communication technology chain with a firm position in the global electronics industry. The integrated-circuit (IC) packaging industry chain adopts a professional division of labor model, and each process (including wafer dicing, die bonding, wire bonding, molding, and other subsequent processes) must have enhanced process capabilities to ensure the quality of the final product. Increasing quality can also lower the chances of waste and rework, lengthen product lifespan, and reduce maintenance, which means fewer resources invested, less pollution and damage to the environment, and smaller social losses. This contributes to the creation of a green process. This paper developed a complete quality evaluation model for the IC packaging molding process from the perspective of a green economy. The Six Sigma quality index (SSQI), which can fully reflect process yield and quality levels, is selected as a primary evaluation tool in this study. Since this index contains unknown parameters, a confidence interval based fuzzy evaluation model is proposed to increase estimation accuracy and overcome the issue of uncertainties in measurement data. Finally, a numerical example is given to illustrate the applicability and effectiveness of the proposed method.
Highlights
Integrated-circuit (IC) packaging is a procedure in which a processed wafer is cut into dies and coated in materials such as resin, ceramics, and metal
The small volume of ICs means that electronic components are very close together, but this allows circuits to work faster and more reliably and protects the crystallites from external contamination
The cluster effect in the electronics industry in Taiwan has resulted in a complete information and communication technology industry chain with a firm position in the global electronics industry [2,3,4]
Summary
Integrated-circuit (IC) packaging is a procedure in which a processed wafer is cut into dies and coated in materials such as resin, ceramics, and metal. Wire sweep, or package warpage will affect subsequent IC product processes or the functions of the final product. We investigate the relationships between the process quality levels ω and the value of a Six Sigma quality index (SSQI) QPU for the three STB quality characteristics. Confidence interval based fuzzy testing method using the upper confidence limit of SSQI QPU to evaluate the quality of the IC packaging molding process. Because this approach is grounded on confidence intervals, it reduces the risk of misjudgment caused by sampling errors and increases the accuracy of decision-making in measuring the quality of the IC packaging molding process.
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