Abstract

Microchannel plate (MCP) gain linearity for high output count rate operation can be extended one to two orders of magnitude, by bonding the MCP to a heat sink [W.B. Feller, Proc. SPIE 1243 (1990) 149]. MCPs in conventional mounting configurations must dissipate resistive heating radiatively, constraining the maximum output count rate to 10 8 − 10 9 cm −2 s −1. A very low resistance MCP was indium-bonded to metal anode pads on a ceramic substrate. Under continuous duty cycle operation, and at very high bias currents (several mA), normal pulse-counting operation was observed at near-ambient temperatures, with measured output count rates approaching 10 10 cm −2 s −1.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.