Abstract
AbstractConductive‐plastic enclosures, to compete successfully in the electronics industry, must be easily and rapidly moldable into a low‐cost, lightweight, structurally sound, flame‐retardant, and electrically‐conductive rigid part. Such a material must combine the design flexibility and moldability of a plastic with the EMI shielding properties approaching those of a metal. PVC filled with aluminum flake makes an excellent conductive composite, provided it is correctly formulated and processed. A critical concentration of metallic filler must be used; it is a function of the plastic formulation; the uniformity of the filler's dispersion; the filler type, size, and morphology; and the method by which it was compounded into the resin.
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