Conductive lithographic films

Abstract

This paper reports progress in the development of a novel fabrication technique for printing circuit board designs directly onto suitable substrates. Circuit tracks can be formed on organic or synthetic substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. The application of this work is in substitutes for conventional (copper-clad resin/laminate) circuit boards where, for low complexity circuits, directly printed substrates offer cost advantages and environmental benefits. The paper is a resume of work and results, including; ink formulation, environmental test, circuit modelling and life cycle analysis. Conductive lithographic films have now been successfully demonstrated in a telephone handset developed in conjunction with Nortel, microprocessor and microwave stripline applications. Whilst developed primarily as a low cost, low environmental impact alternative to subtractive PCB manufacture, other potential advantages such as flexibility and environmental robustness are apparent.