Abstract
An electrodeposition condition to anodically prepare CuO films using slightly acidic solutions of copper acetate (pH 5.5–6.4) is established. The plating solution and solutions with related compositions were investigated using cyclic and linear sweep voltammetry to elucidate the deposition mechanism. The key oxidation reaction that provides for CuO deposition appears to be the oxidation of Cu(II) ions to a Cu(III) species, which subsequently oxidizes water while being reduced to CuO. The solution pH appeared to be critical for these reactions as CuO forms only in solutions with pHs higher than 5.5. The use of acetate ions made it possible to elevate solution pHs to a proper range without chemically precipitating before the initiation of electro- deposition. The resulting films are translucent black and possess smooth surfaces on the microlevel. The as-deposited films are highly crystalline and showed well-defined optical and p-type photoelectrochemical properties that do not improve upon annealing at 300 and . The bandgap and flatband potential are estimated to be and in a solution , respectively.
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