Condensation model of Vapour Phase Soldering

Abstract

This paper presents a modeling approach of vapour condensation during the Vapour Phase Soldering (VPS) process at board level. This model is based on a process (machine) level model which calculates the vapour and temperature space in the VPS tank. The board level condensation model is embedded into the process level model (presented in [1]). The condensation model applies combined transport mechanisms including heat transport by heat conduction; mass transport by phase change during the condensation of the Galden liquid; and energy transport caused by mass transport. The model uses a special dew point calculation which was defined for Galden liquid by experiments. The model can describe the temperature change of the soldered assembly and transmit data to the process level model. This way the effect of the soldered assembly on the vapour space can be investigated.