Abstract
Nanocalorimetry revealed that the annealing kinetics of ion-implanted defects in polycrystalline Si is independent of ion fluence and implantation energy. Ion implantation of 30 keV Si−, 15 keV Si−, and 15 keV C− was performed at fluences ranging from 6×1011 to 1×1015atoms∕cm2, followed by temperature scans between 30 and 450 °C. The rate of heat release has the same shape for all fluences, featuring no peaks but rather a smooth, continuously increasing signal. This suggests that the heat release is dominated by the annealing of highly disordered zones generated by each implantation cascade. Such annealing depends primarily on the details of the damage zone–crystal interface kinetics, and not on the point defect concentration.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
