Computer simulation of thermally activated dislocation motion: Part III. In fcc solid solutions

Abstract

Thermally activated dislocation motion is a much more complicated process than dislocation motion of absolute zero temperature. As a result, only a few analytical theories have been developed to account for the temperature dependence of the yield stress of fcc solid solutions. In previous investigations (Parts I and II), it was shown that by considering a random array of solute atoms, the yield stress as a function of misfit strain and concentration was, as predicted by computer simulation, in reasonable agreement with the experimental results. An investigation was undertaken to determine if the previous computer simulation modeling could be extended to predict the temperature dependence of the yield stress of fcc solid solutions. The results of this investigation indicate that the computer simulation model does predict the correct relationships of stressvs temperature, activation energyvs stress, and activation volumevs stress.