Abstract
In order to provide the best technic parameter for hot pressing, the diffusion bonding temperature fields of Be/HR-1 stainless steel under different cooling methods were simulated by the finite element method. The results show that high temperature parts occur in stainless steel center zone in water cooling and air cooling, and the interface cooling rates follow respectively equation of T = 0.0297 t 2 - 9.3223 t + 1017.6 and equation of T = 0.002 t 2 - 0.7702 t + 1014.8. In funace cooling, high temperature part moves to beryllium center zone and the interface cooling rate follows equation of T = -0.0192 t + 1018.8. While the heat transfer coefficient (h) is taken as 5, the temperature distribution of both sides on the interface is symmetric and temperature gradient is the lowest, so the hot stress on the interface is reduced effectively to improve the diffusion bonding strength, which results fit with the experience ones well.
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