Computer Simulation of Multilayer Structure of TiAlN/CrN Coatings

Abstract

Multilayer hard coatings TiAlN/CrN were prepared by sputter deposition in a commercial device CC800 (CemeCon). The deposition system has four magnetron sources with a circular holder system at the center of vacuum chamber. Single, double, and triple rotation of substrates can be applied. In triple rotation (and to a lesser extent in double rotation) there is a complex set of movements of the sample. High deposition rate occurs only at certain orientations, when the substrate is both close to the target and is facing the target. Depending on the rotation speed of axis and the position of the substrates, different periodic and aperiodic structures can be obtained. Using the geometrical parameters, a computer simulation of multilayer deposition was done. This was achieved by modeling the deposition rate from the magnetron sources and the trajectory of substrates. Shading by substrate holders and special triple rotation was considered. Results of computer simulation were compared to cross-sectional SEM micrographs. Compositional depth profiles were made by AES.