Abstract
3D electronic packaging printer can realize the transformation of electronic packaging from 2D to 3D, and it is a very important new device in the electronic industry. The amplification structure is the key part of it. In this paper, by means of geometric calculation, computer aided design and simulation, an improved rhombic 3D design drawing and key design parameters of the amplification structure are obtained. The rhombic amplification structure is simulated by finite element simulation method, and the simulation amplification coefficient is 9.05, which is consistent with the design amplification coefficient of 9.36. The displacement output diagram and stress cloud diagram show that the displacement and strength of the rhombic amplified structure conform to the service requirements of 3D electronic packaging printer.
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