Abstract
Surface bonding is an essential step in device manufacturing and assembly, providing mechanical support, heat transfer, and electrical integration. Molecular dynamics simulations of surface bonding and debonding failure of copper nanocones are conducted to investigate the underlying adhesive mechanism of nanocones and the effects of separation distance, contact length, temperature, and size of the cones. It is found that van der Waals interactions and surface atom diffusion simultaneously contribute to bonding strength, and different adhesive mechanisms play a main role in different regimes. The results reveal that increasing contact length and decreasing separation distance can simultaneously contribute to increasing bonding strength. Furthermore, our simulations indicate that a higher temperature promotes diffusion across the interface so that subsequent cooling results in better adhesion when compared with cold bonding at the same lower temperature. It also reveals that maximum bonding strength was obtained when the cone angle was around 53°. These findings are useful in designing advanced metallic bonding processes at low temperatures and pressure with tenable performance.
Highlights
Surface bonding is an essential step in device manufacturing and assembly, providing mechanical support, heat transfer, and electrical integration
Traditional surface bonding techniques in electronic assembly strongly rely on high-temperature processes such as reflow soldering, which can lead to undesirable thermal damage, toxic solder materials pollution, and residual stress at the bonding interface [1,2]
We explored the atomic interactions that lead to the formation of surface joints between copper nanocones using molecular dynamics (MD) simulations
Summary
Surface bonding is an essential step in device manufacturing and assembly, providing mechanical support, heat transfer, and electrical integration. The process compatibility and reliability of cold bonding between surfaces with patterned arrangements of nanowires, nanoparticles, and nanocones have been improved by studies of the effects of lowering the temperature and pressure for bonding [4,5,6,7,8]. Such nanometal bonding methods exhibit high bonding strength and low electrical resistance at the interface at ambient or low temperatures.
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
