Computational study of bubble, thin-film dynamics and heat transfer during flow boiling in non-circular microchannels

Abstract

Flow boiling in multi-microchannel evaporators is one of the most efficient thermal management solutions for high-power-density applications. However, there is still a lack of understanding of the governing two-phase heat and mass transfer processes that occur in these devices, which has resulted in a limited availability of applicable boiling heat transfer prediction methods based on first principles, and of reliable thermal design tools. This article presents a systematic analysis of the dynamics of bubbles and the surrounding liquid film during flow boiling in three-side-heated non-circular microchannels. The study is performed using a custom version of ESI OpenFOAM v2106 with a geometric volume-of-fluid method to capture the interface dynamics, also incorporating conjugate heat transfer through the evaporator walls. The hydraulic diameter of the channel is fixed to Dh=0.229mm and the range of width-to-height aspect ratios ϵ=0.25−4 is examined. We investigate different fluids, namely water, HFE7100, R1233zd(E), R1234ze(E), and evaporator materials, namely copper, aluminium, silicon, stainless steel, with base heat fluxes in the range qb=50−200kW/m2. The results show that conjugate heat transfer acts to make the temperature distributions around the perimeter of the channel cross-section more uniform, and that the topography of the lubricating film and the extension of the dry vapour patches that develop while the film is depleted both depend on the cross-sectional channel shape and influence the heat transfer performance significantly. For highly wetting conditions, channels with ϵ=0.25 tend to allow enhanced heat transfer rates, with a spatially-averaged Nusselt number that is 50% higher than that obtained for ϵ=1 (square channels) and 10% higher than that for ϵ=4. This arises thanks to an extended evaporating film that covers the vertical walls which, owing to the three-side-heated configuration, contribute twice to the spatially-averaged heat transfer performance. For more hydrophobic conditions, large dry patches develop over the vertical walls for ϵ=0.25 due to the lower evaporator temperatures, leading to reduced heat transfer, with thermal performance weakly dependent on ϵ in the range ϵ=0.5−2.