Computational Modeling of Intergranular Crack Propagation in燼n營ntermetallic Compound Layer

Abstract

A micromechanical model is presented to study the initiation and propagation of microcracks of intermetallic compounds (IMCs) in solder joints. The effects of the grain aggregate morphology, the grain boundary defects and the sensitivity of the various cohesive zone parameters in predicting the overall mechanical response are investigated. The overall strength is predominantly determined by the weak grain interfaces; both the grain aggregate morphology and the weak grain interfaces control the crack configuration; the different normal and tangential strengths of grain interfaces result in different intergranular cracking behaviors and play a critical role in determining the macroscopic mechanical response of the system.