Computational modeling and analysis of the interfacial debonding in copper/copper and copper/polyether-ether-ketone coatings deposited by cold spraying

Abstract

Cold Spraying (CS) is a promptly developing solid-state additive material deposition technique that is frequently used for high-value metallic component repair. The purpose of this research is to investigate the interfacial adhesion strength of cold-sprayed copper (Cu) coatings deposited on Cu and polyether-ether-ketone (PEEK) substrates for repair applications. In light of this, we propose a computational framework that accounts for both of the two main failure mechanisms, i.e., failure at the Cu/Cu interface caused by plasticity and damage initiation and failure at the Cu/PEEK interface due to brittle crack. Towards this end, different damage models are employed to describe the ductile damage of bulk materials, and a large deformation Cohesive Zone Model (CZM) is developed to model Cu/Cu interface debonding, allowing for stable calculations under large interfacial deformation. The Virtual Crack Closure Technique (VCCT) is used to simulate brittle debonding failure of the Cu/PEEK coating. The threshold stresses for coating debonding, found experimentally, are successfully compared to the numerical predictions. Such debonding modeling techniques might be useful for predicting coating behavior and bonding strength in cold spraying under various loading situations and material combinations.