Computational and Experimental Analysis of a Triode Microfuse with a WO3 Heater

Abstract

In this study, high‐current‐protecting multilayered thin film microfuses are designed and simulated using the MEMS‐based tool of COMSOL multiphysics software and then fabricated and tested in the laboratory. Portable electronic devices are comprised of a secondary battery or DC charge source, and due to short circuit overcurrent, fire, and explosions can ensue. A protecting device should steadily cater to phenomena like overcurrent situations to avoid hazardous circumstances. The primary purpose of this investigation is to design a heater resistor with a negative temperature coefficient (NTC) to function as a low melting point‐based alloy for the fuse element. A lead‐tin (90Pb:10Sn wt.%) alloy has been employed as the low melting point‐based fuse element, and tungsten oxide (WO3) is integrated with the layer as a heater resistor due to its negative temperature coefficient of resistance characteristics. The electro‐thermo‐mechanical behavior is assessed, and a three‐dimensional structural modeling and simulation technique has been performed in both steady‐state and transient conditions with varying physical and electrical parameters. The heat required to melt the fuse depends on heater geometry, and when we applied 2 A current to the 1 : 30 length and width ratio‐based device, the heater achieved 600 K. Experimentally, nearly at 1 A current and above 4 V, the microfuse reached melting temperature and thus has been blown which provides a scope of controlling nearly 4 W of power electronic devices.