Abstract
This study evaluated a micro-jet impingement heat sink for the cooling of electronic field at micro level devices. In the present study, a three-dimensional fluid flow and heat transfer analysis was carried out numerically for different fluids and various heat sink materials. Six different materials as copper, aluminum, steel, silicon, titanium and nickel were analyzed to be used as substrate of the micro-channel heat sink. Water, DIUF water (De-Ionized Ultra-Filtered), Performance fluid-5052, and HF-7100 were used as working fluids. For the micro channel heat sink investigated and obtained that the temperature distribution along the flow direction in the solid and fluid regions have linear behavior. Heat transfer coefficient and temperature distribution was obtained for various cases and the results have been interpreted. It was observed that copper based material has the highest value of heat transfer coefficient as compared to remaining five materials analyzed. Copper and working fluid DIUF water together have the highest heat transfer coefficient
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