Computation of thermal properties of a copper–copper nano interface structure using a MD–ISE–FE method

Abstract

A multiscale modeling method is put forward to investigate the interfacial characteristic of copper nano interface structures. The ISE (Interface Stress Element) method is set as a coupling button to a span-scale model combined with MD (Molecular Dynamics) and FE (Finite Element) methods. Those three methods are effectively coupled by MD–ISE and ISE–FE handshake regions. The thermal properties of copper nano structures are investigated by using this multiscale model. The results show that the accuracy of the MD–ISE–FE model is better than that of MD–FE model; the thermal resistance decreases with the temperature increase. Compared with the MD–FE model, the MD–ISE–FE multiscale model can provide better accuracy to investigate the interface prosperities for MEMS design and manufacturing.