Abstract

In this study, n-type β-FeSi2/p-type Si heterojunctions, inside which n-type β-FeSi2 films were epitaxially grown on p-type Si(111) substrates, were created using radio frequency magnetron sputtering at a substrate temperature of 560°C and Ar pressure of 2.66×10-1 Pa. The heterojunctions were measured for forward and reverse dark current density-voltage curves as a function of temperature ranging from 300 down to 20 K for computation of heterojunction parameters using the thermionic emission (TE) theory and Cheung’s and Norde’s methods. Computation using the TE theory showed that the values of ideality factor (n) were 1.71 at 300 K and 16.83 at 20 K, while the barrier height (ϕb) values were 0.59 eV at 300 K and 0.06 eV at 20 K. Both of the n and ϕb values computed using the TE theory were in agreement with those computed using Cheung’s and Norde’s methods. The values of series resistance (Rs) computed at 300 K and 20 K by Norde’s method were 10.93 Ω and 0.15 MΩ, respectively, which agreed with the Rs values found through computation by Cheung’s method. The dramatic increment of Rs value at low temperatures was likely attributable to the increment of n value at low temperatures.

Highlights

  • At present, semiconducting iron disiliside (β-FeSi2) has received much attention for utilization in novel low-cost optoelectronic devices in part due to its various attractive physical properties [1,2,3]

  • Based on the totality of knowledge among the group members, this manuscript represents the first investigation of its kind for heterojunction parameters at low temperatures for n-type β-FeSi2/p-type Si heterojunctions grown by radio frequency magnetron sputtering (RFMS) using the aforementioned theory and methods

  • The J-V curves for the n-type β-FeSi2/p-type Si heterojunctions grown by RFMS on a logarithmic scale as a function of temperature ranging from 300 down to 20 K

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Summary

Introduction

At present, semiconducting iron disiliside (β-FeSi2) has received much attention for utilization in novel low-cost optoelectronic devices in part due to its various attractive physical properties [1,2,3]. Its composition consists of nontoxic elements (Fe and Si) [5] It possesses high optical absorption coefficients (greater than 105 cm−1 at photon energies above 1.5 eV) [6, 7] and a direct band gap of 0.85 eV corresponding to an optical telecommunication wavelength in the spectral range of near-infrared (NIR) [8, 9]. Molecular beam epitaxy [10], ion beam synthesis [11], and reactive deposition epitaxy [12] have previously been utilized for growth of β-FeSi2 thin films. Since the annealing procedure accelerates the diffusion of Fe atoms into the Si side, it is a potential cause for fabricated heterojunctions without rectifying action.

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