Compressive Deformation Behavior at Elevated Temperatures in a Closed-Cell Aluminum Foam

Abstract

Compressive tests at temperatures of 573–773 K with initial strain rates of 8.0×10−4–2.0×10−1 s−1 were carried out on a closed-cell aluminum foam and its bulk reference aluminum (a cell wall material of the aluminum foam). As a result, the stress exponent and the activation energy for elevated temperature deformation of the aluminum foam were in agreement with those of the bulk reference aluminum. In addition, upon compensation by the relative density, the plateau stress of the aluminum foam was comparable to the stress of the bulk reference aluminum. It is concluded that the elevated temperature deformation mechanism in the aluminum foam is essentially the same as that in the bulk reference aluminum.