Compressive creep aging behavior and microstructure evolution in extruded Al-Mg-Si alloy under different temperature and stress levels

Abstract

Different creeping parameters 70–90 MPa/90–150°C have impact on the compressive creep aging (CCA) behaviors and microstructure evolutions in Al-Mg-Si alloy wires. Interestingly, the higher compressive stress can bring about higher creep resistance. The samples with different creeping compressive stresses have similar average grain sizes of approximately 30 μm, and with increasing creeping temperature, the average grain size is up to 58.5 μm. The intensities of the main textures under 90 MPa/90 °C are significantly stronger than those under other creep parameters, particularly for the Cube texture. The recrystallization rate in 90 MPa/90 °C-CCAed sample is lower than the deformation rate. Moreover, the βʺ precipitates appeared in 90 MPa/90° C- CCAed sample, and were not detectable in samples at a low creeping stress. High stress plays a key role in nucleation, and β'' precipitates are induced under a high creeping stress. Some or all the data, models, or codes generated or used during the study are available from the corresponding author upon request.