Abstract
A transition optimization for vertical launch solder-less compression mount connector to substrate integrated coaxial lines (SICL) transition is presented up to K and Ka bands. The design for the coaxial-to-SICL transition is delineated while emphasizing on the key design parameters considering fabrication feasibility using printed circuit board (PCB) technology. Through full-wave simulations, an improvement of 1.07 dB in the insertion loss exhibited by the coaxial-to-SICL transition is demonstrated by using an array of plated through hole Vias in the vicinity of the transition. Furthermore, potential causes of performance degradations due to imperfect ground connections and SICL bending due to compression are considered. It is shown that SICL bending minimally impacts the performance, however, inadvertent effects such as an air gap may prominently impact the connector performance.
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