Comprehensive Investigation of In-Plane and Out-of-Plane Die Shift in Flexible Fan-Out Wafer-Level Packaging Using Polydimethylsiloxane

Abstract

Die shift in fan-out wafer-level packaging (FOWLP) is a major roadblock, limiting package scaling and performance. It not only limits the wire pitch but also results in reliability problems and yield loss. In this work, we systematically investigate and predict the in-plane and out-of-plane die shift through numerical and experimental analysis in FlexTrate, which is a flexible hybrid electronics (FHE) platform based on FOWLP for flexible heterogeneous integration. First, the in-plane die shift is studied through simulation of the molding process and the substrate cure shrinkage. The molding process is simulated through a fluid analysis which explores the shear force. In addition, a thermo-mechanical analysis simulates the polydimethylsiloxane (PDMS) curing process followed by handler release. Based on this model, the effect of die size, die spacing, die thickness, and PDMS thickness on die shift are analyzed. The results indicate that smaller die size has a larger impact on die shift compared to the other factors. The predicted die shift is compared with the experimental results to verify the validity. Further, the experimental characterization of out-of-plane die shift is analyzed through the study of substrate warpage and die placement force which reveal the deleterious effect of high temperature processes. Finally, using the developed numerical model, the die placement is optimized for a surface electromyography (sEMG) system. This detailed analysis sheds light on the various factors which influence die shift, and hence is an important step to push the boundaries of current FHE to new limits.