Abstract

AbstractThe Hf‐doped indium zinc tin oxide (Hf:InZnSnO) channel for high performance and stable transparent thin film transistors (TFTs) is developed by using a simultaneous cosputtering of InZnSnO and HfO2 targets. The effects of In and Hf composition in Hf:InZnSnO channel on the performance and stability under bias stress for the Hf:InZnSnO channel‐based TFTs are investigated. Herein, the In cations enhance the electrical properties, while the Hf cations reduce the oxygen vacancies in the Hf:InZnSnO channel layer. Adjusting the atomic ratio of In of the InZnSnO target improves the performance of the Hf:InZnSnO‐based TFTs, while introducing an adequate amount of HfO2 improves the bias stabilities and hysteresis characteristics of the Hf:InZnSnO‐based TFTs. The transparent TFT with optimized Hf:InZnSnO channel, with a stoichiometry of Hf0.27In25.96Zn6.99Sn6.16O60.62, that is cosputtered at RF power of 100 W applied to InZnSnO target (In:Zn:Sn = 4:1:1 at%), and RF power of 50 W applied to HfO2 target exhibits a field effect mobility of 11.84 cm2 V−1 s−1 and low shift of threshold voltage of less than 2.5 V under bias stress for 3000 s. The high performance and stability of the Hf:InZnSnO channel‐based TFTs demonstrate the feasibility of transparent TFTs‐related next‐generation display applications.

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