Abstract
TiN films were deposited onto M2 tool steel, type 304 stainless steel and glass substrates using plasma-assisted chemical vapor deposition. TiCl 4 and NH 3 were the reactive gases used, in the pressure range 26.6–133 Pa. The use of the plasma accelerated the rate of film deposition by about one order of magnitude. Auger electron spectroscopy, X-ray diffraction and electron microscopy studies revealed the growth of two types of film depending on the substrate temperature. At 300°C and above, highly crystalline stoichiometric TiN formed with (200) surface orientation and having a columnar grain structure. These films showed good adherence and hardness. Below 300°C an amorphous TiN-Cl complex formed that exhibited poor mechanical properties. Above the transition temperature the formation of gaseous HCl was thermodynamically favored as a reaction byproduct, while the formation of solid NH 4Cl was favored at the lower temperatures. Vickers' microhardness and scratch adhesion measurements were made. At thicknesses greater than 5 μm the films exhibited poorer adhesion because of the build-up of residual stress.
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