Abstract
Methane sulfonic acid based tin–bismuth (Sn–Bi) plating baths containing hydroquinone and gelatin as electrolyte additives were characterized in this work. Potentiodynamic polarization curves were obtained using a potentio/galvanostat to study the polarization behavior in the Sn–Bi plating bath. Galvanostatic deposition was conducted in the Sn–Bi plating bath at applied current densities in the range of 10–30 mA cm−2. The Bi content of the electrodeposits was found to decrease with increasing current density. A relationship between the limiting current density (ilim), the applied current density (iapp) and the weight percent of deposited Bi was derived. The Bi weight percent in the electrodeposits was found to be given by \({i_{\lim }}/{i_{app}} \times 100\%\). The composition of the electrodeposits obtained experimentally conforms to the estimated composition. This work therefore suggests a simple and practical way to estimate the composition of Sn–Bi alloys from polarization curves. This estimation method could be applied to similar regular alloy deposition systems with at least one limiting current density plateau shown on the polarization curve.
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