Abstract
Novel Sn-rich Sn–Au–Ag solder alloys were designed based on the cluster-plus-glue-atom model and the [Sn11Au2]Sn3 and [AuSn8]Au were applied as the basic cluster formulas. The microstructure, melting behavior, wettability and the interfacial reaction of the designed Sn–Au–Ag solders were systematically investigated. The Sn–Au–Ag solders designed based on the [Sn11Au2]Sn3 cluster formula have a better ability to form the near-eutectic composition than those designed based on the [AuSn8]Au cluster formula. The [Sn11Au1Ag1]Sn3 and [Sn11Au0.5Ag1.5]Sn3 solders have near-eutectic compositions, with the melting temperatures of 206.89 and 207.25 °C, respectively. While the Sn–Au–Ag solders designed based on the [AuSn8]Au cluster formula are non near-eutectics. The microstructure of the Sn–Au–Ag bulk solders consists of the AuSn4 and Ag3Sn phases dispersed in β-Sn matrix. The Sn–Au–Ag solders have a better wettability on Ni substrate than on Cu substrate, while the Sn–Ag solder, i.e., [Sn11Ag2]Sn3 has a better wettability on Cu substrate than on Ni substrate.
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