Abstract
A beta-backscatter gauge for composition analysis of tin/lead platings is described. The gauge utilizes 63Ni which emits low energy beta-particles. The average tin content of a 1 μm thick surface layer is determined to an accuracy of 2% tin during a 2-min counting sequence. A composition depth-profile analysis of tin/lead platings on printed circuit boards is carried out by repeated lappings and backscatter measurements. This procedure has in some cases revealed a non-homogeneous structure of the platings.
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Schedule a callMore From: The International Journal of Applied Radiation and Isotopes
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