Composite Microposts with High Dry Adhesion Strength.

Abstract

Interfaces with enhanced and tunable adhesion have applications in a broad range of fields, including microtransfer printing of semiconductors, grippers on robots, and component handling in manufacturing. Here, a composite post structure with a stiff core and a compliant shell is used to achieve an enhanced adhesion under normal loading. Loading the composite structure in shear significantly reduces the effective adhesion strength, thus providing tunability. The composite posts can be used as stamps in microtransfer printing processes or as building blocks of large-area tunable surfaces composed of arrays of posts. Experimental measurements on composite posts with diameters of 200 μm show a peak adhesion strength of 1.5 MPa, a 9 times enhancement in adhesion relative to a homogeneous post under normal loading, and also that the adhesion can be reduced by nearly a factor of 7 through the application of shear. The adhesion behavior of these composite structures was also examined using finite element analysis, which provides an understanding of the mechanics of detachment. Finally, the composite adhesive posts were used as stamps in a microtransfer printing process in which 5 μm thick silicon membranes were retrieved and subsequently printed.