Abstract
In article number 1905470, Yuhang Li, Jizhou Song, and co-workers report a functional soft composite, which incorporates an embedded phase change material with a thin metal film on the top in a soft polymer, as a thermal protection substrate for wearable electronics. Compared with conventional substrates, the proposed functional soft composite offers novel routes to manipulate heat flow and absorb excessive heat energy, which can reduce the peak temperature increase by 85%.
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