Abstract
Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders.
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