Abstract
In order to restrain cement kiln shell’s thermal loss and potential safety hazard, composite design is employed of working layer, thermal-preservation layer and thermal insulation layer. Thermal-preservation layer’s boundary and strain is analyzed and overall thermal conductivity is calculated. The result shows that sinusoidal curve boundary combination between working layer and thermal-preservation layer, slopeshape with angle of 135 degrees between thermal-preservation layer and thermal insulation layer could relieve strain concentration. Composite mullite brick comprehensive thermal conductivity decreases from the working layer 2.74W·m-1·K-1 to 1.50W·m-1·K-1. When applied in cement kiln, temperature of kiln shell is lower 50°C to 70°C than using normal bricks.
Highlights
Cement rotary kiln is high energy consumption mechanical equipment
Higher thermal conductivity leads to high temperature of kiln shell, high heat loss and high fuel consumed, lower lifetime of tire and kiln shell
Multilayer mullite based brick with reduced thermal conductivity choose the method of multilayer structure with working layer, thermal-preservation layer and thermal-insulation layer
Summary
Cement rotary kiln is high energy consumption mechanical equipment. In the latter and upper transition zone, refractory bricks directly contact with clinker without the preservation of coating. Higher thermal conductivity leads to high temperature of kiln shell, high heat loss and high fuel consumed, lower lifetime of tire and kiln shell. In order to restrain kiln shell’s thermal loss and potential safety hazard, method of lower conductivity coefficient of refractory will be the first alternative. Multilayer mullite based brick with reduced thermal conductivity choose the method of multilayer structure with working layer, thermal-preservation layer and thermal-insulation layer. Working layer has been designed with high strength, lower thermal conductivity, high refractoriness under load, high thermal shock resistance and long lifetime; As bonding structure connecting working layer and thermal-insulation layer, thermal preservation layer.
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