Abstract

High-quality polymers such as the benzocyclobutene polymer (BCB) provide interesting dielectric feature for terahertz applications. Already used in silicon integrated circuit technologies, this material could become one of the most promising candidates for the realization of future THz waveguides and interconnections on a silicon substrate but also after active devices process on the top of any other technology (GaAs, InP, GaN…). A frequency-dependent complex permittivity of spin-coated thick layers of this low-k dielectric is obtained from transmittance spectra measured with Fourier transform spectroscopy in the frequency range of 0.5–5.4 THz. The dielectric constant and the loss tangent are discussed according to curing conditions of the photosensitive resin used. A low loss tangent value of 7 − 9 × 10 -3 at 1 THz is obtained with polymerisation in oxygen-free atmosphere. An incomplete curing and a high dose UV exposure have a weak impact on losses. These results associated with the high compatibility of this polymer with silicon and metals make BCB layers well suited for the design of microelectronic THz devices and circuits.

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