Abstract
This paper presents the characterization results of several new passive millimeter wave circuits integrated on very thin ceramic substrate. The work is focused on the design and characterization of a novel rounded Wilkinson power divider, a 90° hybrid coupler, a rat-race coupler, and a novel six-port (multiport) circuit. Measurements show the wideband characteristics, allowing therefore their use for multi-Gb/s V-band wireless communication systems.
Highlights
The use of the 60-GHz band has attracted a great deal of interest over the last few decades, especially for its use in future compact transceivers dedicated to high-speed wireless applications in indoor environments (57–64 GHz) [1,2,3]
In order to improve circuits’ performances, these miniature hybrid microwave integrated circuit (MHMIC) are fabricated in microstrip technology on very thin ceramic substrate
Keeping in the account the 7 GHz bandwidth allowed for V-band communication systems, the data-rates can reach quasi-optical values
Summary
The use of the 60-GHz band has attracted a great deal of interest over the last few decades, especially for its use in future compact transceivers dedicated to high-speed wireless applications in indoor environments (57–64 GHz) [1,2,3]. In this context, intensive research has been done to further develop new millimeter wave components for high data rate wireless communications according to the IEEE 802.15.3c standard. This paper presents novel circuit designs, together with major improvements obtained in fabrication and characterization process in recent years
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