Abstract
To offer a simple set of equations to designers and researchers for describing the degree of planarization (DOP), a first complete analytical solution of film planarization during spin coating is presented. The analytical solutions are suitable for an isolated feature and periodic features in the whole range of . The governing dimensionless parameter represents the ratio of centrifugal force to surface tension force during spin coating. For , surface tension is infinite, and the film is planar. For , surface tension is zero, and the film is always conformal, with an equal thickness everywhere. The analytical solutions agree with the existing experiment data and numerical solutions. A comparison shows that the degree of planarization for an isolated trench is higher than that for an isolated ridge in the range of , but they gradually become identical and independent of for and . For periodic features, is independent of dimensionless film thickness, , dimensionless line spacing, α, and in the range of and . © 1999 The Electrochemical Society. All rights reserved.
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