Abstract

The ductility of thin metal films on polymer substrates reported in recent experiments has a huge disparity, ranging from less than 1 % up to more than 50 %. To reveal the underpinning origins for such a large variation, this paper reports a systematic computational study of two competing failure mechanisms: metal film necking and grain boundary cracking. The quantitative results suggest that strong grain boundaries and metal/polymer interfacial adhesion are keys to achieve high ductility of polymer-supported metal films.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.