Abstract
Wafer-level packaging (WLP) is a next-generation semiconductor packaging technology that is important for realizing high-performance and ultra-thin semiconductor devices. However, the molding process, which is a part of the WLP process, has various problems such as a high defect rate and low predictability. Among the various defect factors, the die shift primarily determines the quality of the final product; therefore, predicting the die shift is necessary to achieve high-yield production in WLP. In this study, the die shift caused by the flow drag force of the epoxy molding compound (EMC) is evaluated from the die shift of a debonded molding wafer. Experimental and analytical methods were employed to evaluate the die shift occurring during each stage of the molding process and that resulting from the geometrical changes after the debonding process. The die shift caused by the EMC flow drag force is evaluated from the data on die movements due to thermal contraction/expansion and warpage. The relationship between the die shift and variation in the die gap is determined through regression analysis in order to predict the die shift due to the flow drag force. The results can be used for die realignment by predicting and compensating for the die shift.
Highlights
The development of semiconductor manufacturing technology for high-performance electronic products is actively pursued, and the degree of integration is undergoing a paradigm shift from two-dimensional (2D) packaging to three-dimensional (3D) packaging technology.Wafer-level packaging (WLP) technology is used for next-generation semiconductor packaging, and it implements high-performance and ultra-thin semiconductors in high-performance electronic products
We developed a the molding process, the WLP compression molding system is required to satisfy a variety of criteria
The effect of die shift is investigated with respect to the variation of the die gap in the wafer-level molding process
Summary
The development of semiconductor manufacturing technology for high-performance electronic products is actively pursued, and the degree of integration is undergoing a paradigm shift from two-dimensional (2D) packaging to three-dimensional (3D) packaging technology. WLP molding process froma the of processdeformation parameters including due and to the change in theoretical temperature research molding-tape behaviorthermal duringcontraction/expansion the molding process, performed profile the during process, EMC drag force, and EMC curing shrinkage Such die shifts are for predicting die the shift caused by flow mechanical effects during molding. The number of experiments carried out for process setup is limited of the time method’s performance, typically the die shifts caused during each stage of the molding because process were and cost.evaluated, critical to determine the design parameters minimize as wellitasis the die movement caused by theoptimal geometrical changes and thermalto expansion or the die contraction after the molding process. To quantify the method’s performance, the die shifts caused during each stage of the molding process were evaluated, as well as the die movement caused by the geometrical changes and thermal expansion or contraction after the molding process
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