Abstract

Removable encapsulants have been developed as replacement materials for electronic encapsulation. They can be removed from an electronic assembly in a fairly benign manner. Encapsulants must satisfy a limited number of criteria to be useful. These include processing ease, certain mechanical, thermal, and electrical properties, adhesion to common clean surfaces, good aging characteristics, and compatibility. This report discusses one aspect of the compatibility of removable blown epoxy foams with electronic components. Of interest is the compatibility of the blowing agent, Fluorinert{trademark} (FC-72) electronic fluid with electronic parts, components, and select materials. Excellent compatibility is found with most of the investigated materials. A few materials, such as Teflon{reg_sign} that are comprised of chemicals very similar to FC-72 show substantial absorption of FC-72. No compatibility issues have yet been identified even for the few materials that show substantial absorption.

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