Abstract
Single shear-lap specimens having a solder joint area of 1 mm2 and nominally 100-µm thickness on copper substrates were crept at 85°C and compared to dual shear-lap specimens with copper and nickel interfaces that were thermomechanically cycled from −15°C to 150°C to mimic the solder-joint deformation history of surface-mount components. Electron microscopy revealed surface cracks in some grain boundaries in the creep specimen and shear bands and other surface relief features on the originally polished surfaces after 100 cycles with short times at high temperature and long times at cold temperature. Orientation imaging microscopy (OIM) studies of various regions of these specimens were used to determine how the microstructure and crystallographic orientations evolved with creep or thermomechanical cycling. These results are compared to ascertain how strain path, the anisotropy of Sn, and various slip systems could account for crack nucleation and ultimate failure of the solder joint in surface-mount components.
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