Comparison of via/line package level vs. wafer level results

Abstract

Comparison of lifetime projections from a wafer level test and a package level test (on equivalent parts) is demonstrated, given activation energy and current density exponent from the package level test. Comparison of the acceleration factor between the wafer and package level tests yields good agreement and is described in detail. Kinetics determined from both tests are presented. Physical failure modes are different for the two tests, and implications are discussed.