Abstract
We compare ultrasonic welding (UW) and thermal bonding (TB) for the integration of embedded thin-film gold electrodes for electrochemical applications in injection molded (IM) microfluidic chips. The UW bonded chips showed a significantly superior electrochemical performance compared to the ones obtained using TB. Parameters such as metal thickness of electrodes, depth of electrode embedding, delivered power, and height of energy directors (for UW), as well as pressure and temperature (for TB), were systematically studied to evaluate the two bonding methods and requirements for optimal electrochemical performance. The presented technology is intended for easy and effective integration of polymeric Lab-on-Chip systems to encourage their use in research, commercialization and education.
Highlights
One of the major issues in the assembly of polymeric micro- and nanofluidic systems is proper sealing of the devices [1]
The samples bonded with the optimized recipes were used for the electrochemical measurements: the ultrasonic welding (UW)-bonded chips showed good performance based on both cyclic voltammetry (CV) and electrochemical impedance spectroscopic (EIS) characterization
We have presented device integration using a process that involves the ultrasonic welding (UW)
Summary
One of the major issues in the assembly of polymeric micro- and nanofluidic systems is proper sealing of the devices [1]. The use of UW to weld COC-based polymer systems with electrodes was previously roughness that is three orders of magnitude smaller than the energy directors allows the suggested by Naseri et al [23] They neither gave any details on the welding quality, nor concentration the ultrasonic energy,the andgeometry bonding a lower amount of energy compared provided any of information regarding of the using energy directors. To rougher samples that can cause energy dispersion on the substrate surface For this reason, the presented IM electrodes (2 or 5 mm wide and several mm long) made of carbon-loaded COC, coated energy directors can be lower than in the case of substrates with higher surface roughness, such as one-by-one with different thin metal films used as electrodes and embedded in the fluidics by means the ones obtained byprocess.
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