Abstract

Evidence is presented that two competing failure mechanisms exist in the Si-SiO2 system with one mechanism dominating at low dose rates and the other at high. Much lower dose failures than expected were discovered at low dose rates (<0.1 rad(Si)/s) and very low dose rates (∼0.001 rad(Si)/s) in commercial SGS 4007 CMOS devices. These failure doses plotted versus dose rate have a bell-shaped curve, rather than the expected straight line (decreasing with increasing dose rate), indicating that a different failure mechanism is dominant at low dose rates than at high.

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