Abstract
Abstract This study focuses on the influence of helium ion irradiation on the microstructure and retention of tungsten (W) and tungsten-chromium (W-Cr) alloy films. Under helium irradiation with fluence of 1.04 × 1022 He2+ / m2, blisters are found on the surfaces of both W film and W-Cr alloy film. The size and density of blisters on the surface of W-Cr alloy film are smaller than those of W film. As a result of grain refinement by the addition of 5% chromium, the density of grain boundaries in W-Cr alloy film is higher than that of W film. These grain boundaries trap helium atoms and reduce the effective mobility of helium atoms. Thereby, helium blister formation and helium released amount of W-Cr alloy film have been reduced compared to W film under helium irradiation.
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