Abstract
Hard gold and silver are applied in coating owing to their high hardness, good wear and corrosion resistance for engineering application (e.g. on generators slip rings, sliding contacts and small machine parts) and are typically plated on copper (mostly), brass and bronze. The studied nickel-hardened gold and silver coatings were brush plated on open thin-walled copper ring substrates. Residual stresses in the coatings were calculated from the curvature changes of the substrates. Biaxial intrinsic residual stresses were also determined by nanoindentation testing and by the X-ray technique. The values of the residual stresses represented tensile stresses and when determined by the techniques used they were comparable within a maximum limit of measurement uncertainty. These stresses relax; the dependence of relaxation time was approximated by a linear-fractional function. DOI: http://dx.doi.org/10.5755/j01.ms.22.1.7439
Highlights
The properties of an engineering component are to a great extent determined by its surface properties [1]
The values of the residual stresses represented tensile stresses and when determined by the techniques used they were comparable within a maximum limit of measurement uncertainty
Selective areas can be plated and the stylus, covered with an absorbent material soaked in the electrolyte, can be moved to the substrate or, alternatively, the substrate can be moved in relation to the fixed anode. In this case the anode is replenished with the plating solution by drops from a separatory funnel or by means of a pump, and the coating is deposited at uniform rotation speed, which guarantees a relatively homogeneous temperature of the deposition process
Summary
The properties of an engineering component are to a great extent determined by its surface properties [1]. Selective areas can be plated and the stylus (anode), covered with an absorbent material soaked in the electrolyte, can be moved to the substrate (cathode) or, alternatively, the substrate can be moved in relation to the fixed anode. In this case the anode is replenished with the plating solution by drops from a separatory funnel or by means of a pump, and the coating is deposited at uniform rotation speed, which guarantees a relatively homogeneous temperature of the deposition process. As the plating process takes place at room temperature, no heater is required
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