Abstract
This paper reports on a comparison of the six- and ten-step phase shifting methods in digital transmission photoelasticity and the application of these methods to obtain the residual stresses in thin (200 μm), flat crystalline silicon wafers (156 mm square). The ten-step phase shifting technique is judged to be superior with reduced noise in the isoclinics and a resulting higher accuracy when dealing with the near-zero retardation prevalent in residual stress measurements of silicon wafers.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.