Comparison of off-axis and in-line electron holography as quantitative dopant-profiling techniques

Abstract

Many different dopant-profiling techniques are available for semiconductor device characterization. However, with length scales shrinking rapidly, only transmission electron microscopy (TEM) techniques promise to fulfil the spatial resolution required for the characterization of future device generations. Here, we use three advanced TEM techniques, off-axis electron holography, Fresnel imaging (in-line electron holography) and Foucault imaging, to examine a focused ion beam-prepared silicon p–n junction device. Experiments are carried out on electrically unbiased samples and with an electrical bias applied in situ in the TEM. Simulations are matched to experimental data to allow quantitative conclusions to be drawn about the underlying electrostatic potential distributions. The off-axis electron holography and Fresnel results are compared to assess whether the techniques are consistent, and whether they can be used to provide complementary information about dopant potentials in semiconductor devices.