Comparison of laser link crossbar and Omega network switching for wafer-scale integration defect avoidance

Abstract

A study is presented of the design tradeoffs between two wafer scale defect avoidance methods: laser linking and active switches. Laser linking methods use laser processing to make signal line connections and cuts. Alternately active transistor switching elements, like the Omega network, can circumvent defects. WSI systems would benefit from a combination of both methods. The requirements of both for silicon area, signal delay, power consumption, probable switch yield and defect avoidance flexibility are considered. As an experimental vehicle an 8/spl times/8 Omega network and laser link crossbar switch was fabricated and tested. >