Abstract

Experiments were performed on 2.3 nm thin gate oxides. The interface state density and the low voltage stress induced leakage current are compared after uniform and localized stresses. The energy distribution of interface state density in the bandgap is then determined. The normalized variations of interface state density and gate leakage current are shown to be comparable after localized stress but completely different after uniform stresses.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.