Abstract

Data on image shortening effects with patterns replicated with x-ray and optical lithography are presented. The x-ray exposures were performed at the IBM Advanced Lithography Facility using the Helios superconducting storage ring and a SUSS stepper. The optical exposures were performed using SVGL Micrascan 1 and 2 tools and biased optical masks. The results indicate that the image shortening effects using x-ray lithography (XRL) are considerably less pronounced than the effects observed with the optical tools. In addition, modeling of the image shortening effects for XRL using the xmas three-dimensional program for resist patterns is presented and compared with experimental results.

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